TDK Expands µPOL DC-DC Power Module Family with High-Performance FS1525 for AI Servers and Data Centers
TDK Corporation has announced an expansion of its acclaimed µPOL (micro Power Over Local) family of non-isolated DC-DC power modules with the introduction of the FS1525, a cutting-edge point-of-load (PoL) converter engineered for the rigorous demands of modern AI servers, edge computing platforms, and data center systems. The FS1525, just 3.82 mm in height, represents a leap forward in compact, high-current power delivery, providing up to 25 A of continuous output while offering remarkable scalability through stacking and paralleling, enabling combined currents up to 200 A for advanced vertical power delivery designs.
Advanced Vertical Power Delivery Architecture
One of the standout features of the FS1525 is its ability to support vertical power delivery architectures, a novel approach where PoL converters are positioned directly beneath high-performance processors, FPGAs, or ASICs on the backside of the PCB. This placement minimizes power path lengths, reduces parasitic losses, and improves thermal dissipation. By stacking or paralleling multiple FS1525 modules, designers can efficiently deliver high currents—up to 200 A—directly to modern AI processors, achieving optimal energy efficiency in high-density computing systems.
Integration and Miniaturization through 3D Chip-Embedded Packaging
Leveraging state-of-the-art 3D chip-embedded package technology, the FS1525 integrates all critical components—including the controller, gate driver, MOSFETs, digital core, memory banks, bypass capacitors, and power inductor—into a single compact module with a footprint of just 7.65 x 6.80 mm. This high level of integration drastically reduces the board space required, simplifies PCB layout, and supports high-density system designs. The thermally enhanced architecture, with a thermal impedance of only 1.4 K/W, enables superior current performance even at elevated ambient temperatures, outperforming traditional discrete power solutions.
Flexible Input and Output Ranges for Modern AI Workloads
The FS1525 is designed to accommodate a wide range of input voltages, from 4.5 V to 16 V, and delivers adjustable output voltages between 0.6 V and 1.8 V, making it ideal for powering modern low-voltage AI processors and sub-systems. It is especially well-suited for 3-nm to 6-nm ASIC cores and high-speed SERDES rails, providing sub-5 mV peak-to-peak ripple to ensure clean power delivery. Its low spectral noise makes it compatible with high-precision applications such as DSPs, imaging systems, and automated test equipment (ATE).
The module’s fast transient response, low output ripple, and true differential remote sensing ensure accurate voltage regulation at the point of load, even under dynamically changing workloads typical of AI and machine learning environments. This ensures stable operation for high-speed, high-density computing platforms where precise power delivery is critical.
Digital Programmability and Real-Time Telemetry
To meet the evolving needs of intelligent computing systems, the FS1525 offers digital programmability via I²C and PMBus, enabling adaptive tuning, real-time telemetry, and comprehensive fault management. System designers can monitor voltage, current, and temperature in real time, while leveraging programmable features to optimize performance for specific workloads. For FPGA and SoC applications, analog output voltage settings are available, with full support for advanced power management protocols such as Altera’s SmartVID, making it fully compatible with Altera Agilex™ FPGAs and other leading-edge processors.
Seamless Integration Across Modern Computing Form Factors
The FS1525 is highly versatile and compatible with a broad range of system architectures and form factors, including PCIe, VPX, SMARC, and 1U–3U rack systems. This flexibility allows designers to integrate high-performance PoL modules into diverse computing environments with minimal redesign effort. The module has already been deployed in verified designs for Altera Agilex™, AMD Versal™ Edge, AMD-Xilinx Zynq UltraScale+ MPSoC, and Versal ACAP platforms, all widely used in AI, machine learning, and high-performance computing applications.
A Unified Power Solution for Scalable AI Systems
As part of TDK’s comprehensive µPOL portfolio, which spans currents from 1 A to 200 A, the FS1525 offers a plug-and-play power solution for system designers. It requires no external compensation, significantly simplifying development cycles, reducing design complexity, and lowering overall system costs. TDK’s approach provides more than just a power module; it represents a complete ecosystem for intelligent, scalable power delivery, allowing engineers to focus on performance and innovation rather than complex power management challenges.
Evaluation boards for 25 A and 50 A are readily available through DigiKey and Mouser, while stackable boards capable of delivering 100 A and 200 A are available upon request, allowing rapid prototyping and system validation for high-performance computing platforms.
Conclusion
With the FS1525, TDK continues to redefine the state of the art in micro PoL converters. Its high current density, low-profile design, advanced 3D integration, and digital programmability make it an ideal choice for next-generation AI servers, edge computing systems, and high-density data centers. By providing scalable, efficient, and thermally optimized power solutions, TDK enables designers to achieve maximum performance while simplifying system architecture, ultimately driving the future of intelligent computing.
