AMD Advances Space Computing With Versal AI Core Adaptive SoC in Enhanced Space-Grade Package
AMD has announced the sampling of its AMD Versal™ AI Core XQRVC1902 adaptive SoC in an enhanced space-grade package, marking another step toward delivering high-performance onboard computing for demanding space missions. The company is providing early access samples to select customers as it works toward achieving the highest level of quality and reliability qualification for spaceflight components.
Designed specifically for long-duration missions, the new space-grade organic lidless package is engineered to support applications with mission lifetimes of up to 15 years. AMD is currently testing the XQRVC1902 device against the U.S. military specification MIL-PRF-38535 Class Y qualification, which represents the highest level of quality and reliability under the standard for spaceflight components.
The combination of advanced adaptive computing and a package engineered for the extreme conditions of space is intended to address the growing need for high-performance onboard processing without compromising long-term reliability.
Designed for Long-Duration Space Missions
Spacecraft are increasingly expected to process more data and execute sophisticated algorithms directly onboard. At the same time, missions operating far from Earth must meet stringent reliability requirements, often with limited opportunities for maintenance or intervention.
AMD’s enhanced space-grade package is designed to address these challenges through a combination of conservative design rules and an improved organic substrate material. These design changes are intended to help mitigate the thermal and mechanical stresses that electronic components can experience during extended operation in space.
The package also incorporates space-grade chip capacitors with established flight heritage. Together, these enhancements are designed to extend the advanced programmable logic, processing capabilities and in-orbit computing features of the XQR Versal AI Core platform to missions where reliability is a critical requirement.
Potential applications include human-rated missions, long-duration spacecraft and other high-value programs operating across a wide range of orbital and deep-space environments. These include geosynchronous Earth orbit, cislunar orbit, heliocentric orbit and deep-space missions.
By combining advanced processing capabilities with a package optimized for long-term space operation, AMD is targeting applications where onboard computing performance and reliability must be delivered together.
Moving Toward Class Y Qualification
AMD’s current sampling program represents an important stage in the development of the XQRVC1902 for high-reliability space applications. Early access customers can use the devices to begin developing and evaluating engineering models ahead of the anticipated completion of Class Y qualification.
“Space missions increasingly require both advanced onboard processing and exceptional long-term reliability,” said Ken O’Neill, Aerospace and Defense lead systems architect at AMD. “The availability of XQR Versal AI Core adaptive SoC samples in AMD advanced space-grade packaging marks an important milestone toward Class Y qualification and enables customers to construct engineering models using this technology for missions demanding absolute reliability.”
Class Y qualification is particularly significant for applications where component quality and reliability are essential to mission success. By working toward this qualification, AMD is positioning the XQRVC1902 for use in programs with stringent requirements for long-term performance and operational assurance.
The qualification effort also gives customers an opportunity to begin integrating the technology into system designs before flight-qualified units become available.
High-Performance Adaptive Computing for Space
At the heart of the platform is the AMD Versal AI Core adaptive SoC, which provides adaptable, high-performance processing for onboard payload applications. The device is designed to deliver significant generational improvements in compute density across several key areas of space-based processing.
These capabilities include increased performance for vector-based algorithms, expanded system logic resources, greater on-board SRAM capacity and multigigabit transceivers.
Such capabilities can support increasingly sophisticated payload-processing workloads, allowing spacecraft to perform more analysis and computation closer to where data is generated.
Onboard processing can be particularly valuable for missions that generate large volumes of sensor, imaging or scientific data. Instead of relying entirely on communications links to transmit raw information back to Earth, spacecraft can use local processing resources to analyze, filter or otherwise process data before transmission.
The adaptive architecture of the Versal AI Core platform provides additional flexibility for mission designers, enabling processing resources to be configured for different workloads and mission requirements.
Lidless Package Improves Thermal Performance
The new package uses a lidless architecture, which is designed to improve thermal performance while expanding the range of environments in which AMD can deploy its space-oriented Versal AI Core technology.
Thermal management is a major consideration for spacecraft electronics. Components must operate reliably despite the absence of conventional terrestrial cooling environments and the wide temperature variations associated with spaceflight.
The lidless package is designed to improve thermal characteristics while maintaining the reliability requirements necessary for demanding missions. This approach also enables AMD to support a broader spectrum of space programs.
These programs range from commercial “new space” missions that may use commercial off-the-shelf components to human-rated missions with significantly more stringent reliability requirements. The technology is also intended for next-generation orbital, deep-space and long-duration exploration programs.
Pin Compatibility Simplifies System Development
Another feature of the new package is its pin compatibility with existing AMD Versal AI Core VC1902 commercial, defense-grade and space-grade devices using the 2,197-ball grid array package.
This compatibility can provide system designers with greater flexibility when developing platforms across different qualification and mission requirements. Organizations can work from a common device architecture while selecting the appropriate package and qualification level for a particular application.
For aerospace and defense customers, this can help streamline development efforts as systems progress from early engineering models toward more demanding operational configurations.
The ability to use a compatible footprint across product variants can also help support design reuse and simplify migration between commercial, defense and space-oriented implementations.
Supporting the Next Generation of Space Missions
The introduction of the enhanced space-grade package reflects the broader evolution of spacecraft toward increasingly capable onboard computing architectures.
As missions become more complex, spacecraft are being asked to perform sophisticated processing closer to the source of the data. This trend spans Earth observation, communications, scientific research, navigation, exploration and other applications.
At the same time, missions operating for many years — particularly those involving human spaceflight, deep-space exploration or high-value scientific payloads — require components capable of maintaining dependable operation throughout extended mission lifetimes.
AMD’s XQR Versal AI Core platform is designed to address both requirements by combining programmable logic, advanced processing resources, memory and high-speed connectivity within an adaptive SoC architecture.
The enhanced space-grade package extends these capabilities to applications requiring greater reliability assurance and longer mission lifetimes.
Availability and Qualification Timeline
AMD Versal AI Core XQRVC1902 adaptive SoCs in the enhanced space-grade package are currently sampling with early access customers. The devices and package details are described in AMD datasheet DS946.
The company expects Class Y flight-qualified units to become available in the second half of 2027.
With sampling already underway, early access customers can begin developing engineering models and evaluating the technology for future missions. The progression toward Class Y qualification is expected to further expand the range of applications for the XQRVC1902, particularly in programs where long-term reliability, onboard processing performance and mission assurance are critical requirements.
As space missions continue to demand greater computational capability, the combination of adaptive processing and purpose-built space-grade packaging could provide system designers with additional options for deploying advanced computing in some of the most demanding environments beyond Earth.
Source Link: https://newsroom.amd.com/