Veeco Instruments Inc. (NASDAQ: VECO) announced a significant breakthrough in the field of atomic layer deposition (ALD), as the University of Michigan published a pioneering study on the deposition of molybdenum disulfide (MoS₂) using a novel chemical approach. The research, which appears in the Chemistry of Materials journal, demonstrates the successful use of di-tert-butyl disulfide (TBDS) as a safer alternative to the traditionally used hydrogen sulfide (H₂S) for the ALD process. This innovative work was conducted using Veeco’s Fiji G2 plasma-enhanced ALD (PEALD) system, showcasing the system’s capabilities in producing high-quality two-dimensional (2D) materials. Led by Professor Ageeth Bol of the University of Michigan’s Chemistry and Materials Science and Engineering departments, a team of students and postdoctoral researchers developed a PEALD process that combines an organometallic precursor with TBDS and hydrogen (H₂) plasma. Their method successfully yields stoichiometric and high-quality MoS₂ films while addressing significant safety and cost concerns associated with the use of hazardous H₂S gas. This advancement marks a major step toward enabling large-scale manufacturing and commercial integration of 2D transition metal dichalcogenides, which are known for their unique electrical, optical, and mechanical properties. These materials have broad potential applications in flexible electronics, sensors, optoelectronics, and energy storage. Ganesh Sundaram, Vice President of Technology for ALD and Molecular Beam Epitaxy (MBE) at Veeco, emphasized the importance of this breakthrough in overcoming challenges related to traditional synthesis routes while highlighting the benefits of Veeco’s system in achieving superior film quality and process safety. Professor Bol also praised the performance and reliability of the Fiji system, noting that her group is currently commissioning a second Fiji unit—the third system delivered to the University of Michigan—to support ongoing research initiatives. This collaboration between academia and industry underscores the growing interest and momentum in developing scalable solutions for 2D materials, with Veeco’s advanced PEALD technology playing a pivotal role in advancing the field.
About Veeco
Veeco (NASDAQ: VECO) is an innovative manufacturer of semiconductor process equipment. Our laser annealing, ion beam, chemical vapor deposition (CVD), metal organic chemical vapor deposition (MOCVD), single wafer etch & clean and lithography technologies play an integral role in the fabrication and packaging of advanced semiconductor devices. With equipment designed to optimize performance, yield and cost of ownership, Veeco holds leading technology positions in the markets we serve.