Adamantine Thermal™ by Diamond Quanta Redefines Next-Generation Semiconductor Packaging

The future of advanced semiconductor packaging just got brighter—and cooler. Diamond Quanta has announced Adamantine Thermal™, an engineered-diamond thermal platform designed to integrate seamlessly into advanced packaging workflows and heterogeneous semiconductor systems. This breakthrough follows the company’s standout debut at CES 2026 and addresses a critical challenge facing the electronics industry: efficient thermal management at scale.

Bridging Innovation and Industrial Reality

At CES 2026’s Eureka Park, Diamond Quanta showcased 300 mm diamond-on-silicon wafer technology compatible with wafer-to-wafer (W2W) and chip-to-wafer (C2W) bonding processes. The company also introduced Adamantine Optics™, its first commercial diamond glass product. These demonstrations sparked significant interest from system OEMs, semiconductor manufacturers, and ecosystem partners exploring practical applications for diamond materials in advanced packaging solutions.

Adamantine Thermal builds directly on this foundation, leveraging the same engineered-diamond manufacturing techniques introduced at CES. While diamond’s exceptional intrinsic thermal conductivity has long been recognized, its adoption in modern semiconductor packaging has been hindered by surface roughness, bonding incompatibility, and scalability challenges.

How Diamond Quanta Solved the Integration Challenge

Diamond Quanta’s innovative approach tackles these obstacles head-on through three key technological advancements:

CMOS-Compatible Manufacturing

The platform utilizes low-temperature diamond growth on industry-standard substrates, ensuring compatibility with existing semiconductor fabrication infrastructure.

Laser-Based Surface Densification

Advanced laser processing creates smooth, bond-ready diamond surfaces that meet the exacting requirements of modern packaging workflows.

Flexible Bonding Workflows

Support for both W2W and C2W bonding enables integration into complex advanced packaging stacks, opening doors for diverse applications.

“Thermal is the most immediate and universal entry point for diamond in electronics,” said Adam Khan, Founder and CEO of Diamond Quanta. “Once diamond can be bonded reliably and at scale, it stops being a research material and becomes a practical platform.”

Engineered-Diamond Glass Interposers: The Killer Application

A particularly promising application for Adamantine Thermal is engineered-diamond glass interposers. Glass interposers are already gaining traction in advanced packaging for their superior signal integrity and dimensional stability. By integrating diamond with glass cores, Diamond Quanta enables more uniform thermal management while simultaneously improving flatness and mechanical robustness—critical factors for next-generation heterogeneous systems.

The platform’s architecture specifically supports the W2W and C2W bonding approaches essential for advanced interposers and stacked semiconductor systems. By maintaining compatibility with standard fabrication infrastructure and panel-scale workflows, Adamantine Thermal serves as a bridge between today’s passive thermal materials and tomorrow’s diamond-enabled electronic architectures.

From Research Lab to Production Floor

Diamond Quanta has confirmed that Adamantine Thermal is now entering partner evaluation programs. Engineered-diamond interposer concepts are advancing in lockstep with industry adoption cycles for advanced packaging technologies, signaling a transition from experimental curiosity to commercial viability.

The thermal platform complements the recently launched Adamantine Optics offering and reinforces Diamond Quanta’s comprehensive roadmap spanning thermal management, photonics, interposers, and future diamond-enabled systems.

Ready to Explore Diamond-Enabled Solutions?

As the semiconductor industry pushes the boundaries of performance and integration density, innovative thermal management solutions like Adamantine Thermal will prove essential. To learn more about how Diamond Quanta’s engineered-diamond platforms can enhance your advanced packaging workflows, visit their website or contact their team to discuss partnership opportunities.

ABOUT DIAMOND QUANTA

Based in Mountain View, California, Diamond Quanta is a materials and semiconductor enablement company developing an engineered-diamond platform designed to integrate into existing semiconductor manufacturing workflows. The company focuses on addressing system-level constraints in advanced electronics, including thermal management and optical performance, through scalable, manufacturable diamond-based solutions. Diamond Quanta’s mission is to make diamond as accessible to the world as silicon. The Physics of Forever™. Learn more at www.diamondquanta.com or contact info@diamondquanta.com.

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