Niron Magnetics expands policy engagement to accelerate next-generation magnet production Niron Magnetics, a company focused on developing high-performance permanent magnets made from iron nitride rather than rare earth materials, has announced the opening of a new office in Washington, D.C.…
NEC Corporation today announced the launch of its new NEC Composable Disaggregated Infrastructure Solution in Japan. This cutting-edge offering enables data centers, research institutions, and enterprise IT environments to flexibly deploy distributed computing resources—including servers, GPUs, and other high-performance components—across…
Rimini Street Celebrates Industry Recognition for AI Innovation, Client-First Service, Technical Excellence, and Business Impact Rimini Street, the Software Support and Agentic AI ERP Company™ and the global leader in third-party support for Oracle, SAP, and VMware applications, announced a…
The global PC market delivered a solid rebound in 2025, with total shipments rising 9.2% year over year to reach 279.5 million units, according to the latest research from Omdia. Growth was driven by steady enterprise refresh cycles, sustained notebook demand, and…
Peak Technology Launches APEX to Transform OEM Collaboration in Advanced Manufacturing As advanced manufacturing accelerates under the forces of Industry 4.0, deep tech OEMs are under increasing pressure to move faster—from rapid prototyping to high-volume production—without sacrificing precision, traceability, or…
Xsolla Launches Two Weeks of Industry Programming, Community Events, and Developer Support Across the United Kingdom Xsolla, a global leader in video game commerce solutions, has announced an ambitious and wide-ranging program of industry events, partnerships, and community activations across…
OMRON Electronic Components has introduced the P6K relay sockets, a surface-mount solution designed specifically for the G6K PCB terminal-type relay series. This launch aims to simplify printed circuit board (PCB) assembly and field repairs for equipment manufacturers. By enabling solderless…
SEEQC Forms US-Taiwan Alliance to Commercialize Quantum-on-a-Chip SEEQC has established a bilateral quantum technology ecosystem between the United States and Taiwan to accelerate the production of its digital quantum computing platform. The initiative integrates SEEQC’s proprietary chip-scale architecture with Taiwan’s…
Soluna Holdings and Siemens have launched a 2 MW pilot at Project Grace in Texas to solve power volatility in AI computing. By integrating Siemens’ infrastructure with Soluna’s renewable-first data centers, the partnership aims to stabilize rapid GPU-driven energy swings,…
Quectel Wireless Solutions has introduced the RG660QA and RG660QB 5G modules, built on Qualcomm’s X85 and X82 5G Modem-RF systems respectively. Engineering samples for these initial models in the RG660Qx series are already available to customers, with pre-production units set…