Taipei, Taiwan – Hon Hai Research Institute (HHRI), the research arm of Hon Hai Technology Group (Foxconn) (TWSE: 2317), the world’s largest electronics manufacturer and technology service provider, has achieved a significant breakthrough in quantum computing. Researchers from HHRI’s Quantum Computing…
Tokyo Electron (TEL; Head Office: Minato-ku, Tokyo; President: Toshiki Kawai) has extended its strategic partnership with imec, a world-leading research and innovation hub in nanoelectronics and digital technologies. The agreement marks the start of a new five-year phase in their…
Successful customer tape out of HBM3 design on SF2 process and I-CubeS technology leveraged Synopsys 3DIC Compiler to reduce turnaround time by 10X .New Synopsys certified AI-driven digital and analog flows on SF2P accelerate development of high-performance designs .AI-driven design technology co-optimization…
(Nasdaq: SNPS) today announced that its collaboration with Broadcom has achieved interoperability between Synopsys’ PCIe 6.x IP solution and Broadcom’s PEX90000 series switch. As a cornerstone of next-generation AI infrastructures, PCIe switches play a critical role in enabling the scalability required to meet…
(NYSE: KEYS) and Synopsys, Inc. (Nasdaq: SNPS) introduced an AI-powered RF design migration flow to expedite migration from TSMC’s N6RF+ process to N4P technology, to address the performance requirements of today’s most demanding wireless integrated circuit applications. Building on TSMC’s…
PARIS— At NVIDIA GTC Paris, Cadence (Nasdaq: CDNS) announced it is providing optimized solutions for the world’s first industrial AI cloud in collaboration with NVIDIA. Customers will be able to accelerate the development of their industrial technology by leveraging Cadence’s industry-leading solutions, optimized…
Cadence today announced IP, design solution, and expert design services for software and Systems-on-Chip (SoCs) based on Arm® Zena™ Compute Subsystems (CSS), Arm’s first-generation CSS for automotive. This achievement is the first deliverable resulting from a collaboration with Arm announced in 2024 to jumpstart…
Sony Semiconductor Solutions Corporation (SSS) today announced the upcoming release of the IMX479 stacked, direct Time of Flight (dToF) SPAD depth sensor for automotive LiDAR systems, delivering both high-resolution and high-speed performance. The new sensor product employs a dToF pixel…
Japan — Sony Semiconductor Solutions Corporation (Sony), SCREEN Holdings Co., Ltd. (SCREEN), and VitroVo Inc. (VitroVo) today announced that they have jointly developed and will offer on a trial basis a microelectrode array (MEA) system powered by high-density CMOS-MEA*1 equipped with…
HCLTech and AMD Partner to Accelerate Enterprise Digital Transformation HCLTech and AMD have announced an expanded collaboration aimed at accelerating digital transformation and enhancing customer experience for enterprises. By leveraging the strengths of both organizations, the partnership seeks to build…