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Cadence Expands Verification IP Portfolio with 10 New Solutions for AI Chip Designs

Cadence has announced a significant expansion of its Verification IP (VIP) portfolio with the introduction of 10 new VIP offerings designed specifically to support the next wave of high-performance, AI-focused semiconductor designs. As the artificial intelligence industry rapidly evolves, emerging…

  • THE ELECTRONICS DATA
  • November 22, 2025
  • Intelligence

New German Supercomputer Set to Accelerate AI Research and Scientific Discovery

Equinix,, recognized globally as the world’s premier digital infrastructure company®, announced today that Merck KGaA, Darmstadt, Germany—a leading science and technology innovator—has officially deployed a next-generation high-performance computing (HPC) system hosted within an Equinix AI-ready data center in Germany. Built…

  • THE ELECTRONICS DATA
  • November 22, 2025
  • Innovation, News

Synopsys Gathers Industry Leaders to Shape Software-Defined Vehicle Future

Synopsys Brings Together Global Automotive Leaders to Shape the Future of AI-Powered, Software-Defined Vehicles Synopsys recently convened a series of high-profile events with leaders from across the global automotive ecosystem to explore the technologies, engineering trends, and collaborative strategies essential…

  • THE ELECTRONICS DATA
  • November 21, 2025
  • Featured

Tokyo Electron Completes Tohoku Production & Logistics Center

Tokyo Electron Completes Tohoku Production and Logistics Center to Strengthen Manufacturing, Efficiency, and Sustainability Tokyo Electron (TEL), headquartered in Minato-ku, Tokyo and led by President Toshiki Kawai, has announced the completion of the Tohoku Production and Logistics Center, located within…

  • THE ELECTRONICS DATA
  • November 21, 2025
  • Regulation, Press Releases

Foxconn and OpenAI Team Up to Boost U.S. AI Manufacturing

Foxconn and OpenAI Partner to Advance U.S. AI Infrastructure and Strengthen Domestic Manufacturing Hon Hai Technology Group and OpenAI today announced a strategic collaboration aimed at accelerating the design, development, and U.S. manufacturing readiness of next-generation AI infrastructure hardware. The…

  • THE ELECTRONICS DATA
  • November 21, 2025
  • Innovation

Foxconn and Intrinsic Launch AI Factory Joint Venture

Foxconn and Intrinsic Join Forces to Build the AI-Enabled Factory of the Future Hon Hai Technology Group, widely known as Foxconn, and Intrinsic have announced the launch of a joint venture aimed at redefining the next generation of smart factories.…

  • THE ELECTRONICS DATA
  • November 21, 2025
  • Business

Garmin Adds Graphical NOTAM Surface-Closure Alerts to SmartCharts

Garmin Introduces Graphical NOTAMs Overlay and New Weather Features to Enhance SmartCharts and Garmin Pilot Garmin today unveiled a significant enhancement to SmartCharts, the dynamic aviation charting solution integrated within the Garmin Pilot™ app. This new capability, called the Graphical…

  • THE ELECTRONICS DATA
  • November 21, 2025
  • Press Releases

Garmin OnBoard System Takes Top Honor at 2025 DAME Design Awards

Garmin OnBoard System Earns Top Honor in the 2025 DAME Design Awards Garmin, widely recognized as the world’s largest and most forward-thinking marine electronics manufacturer, announced today that its groundbreaking Garmin OnBoard™ system has been named the winner of the…

  • THE ELECTRONICS DATA
  • November 21, 2025
  • Business

Gree Announces Successful Bid for Brazil’s BAND Project

Gree Electric Appliances has successfully secured the bid for three major renovation projects for Bandeirantes, Brazil’s largest broadcasting operation group. The projects cover the headquarters building, the iconic TV tower, and a commercial shopping mall, with a combined cooling capacity…

  • THE ELECTRONICS DATA
  • November 21, 2025
  • Featured

Cadence, TSMC Advance Next-Gen Design with AI-Driven Flows and Node IP

Cadence today unveiled a broad set of breakthroughs in electronic design automation (EDA), intellectual property (IP), and advanced chip design methodologies. These advancements stem from its deep, long-term collaboration with TSMC, a partnership that continues to push the boundaries of…

  • THE ELECTRONICS DATA
  • November 20, 2025
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