Qnity Unveils Advanced Thermal Management Solutions to Support AI and High-Power Electronics
WILMINGTON, Del. — Qnity Electronics, Inc. (NYSE: Q), a leading provider of technology solutions across the semiconductor value chain, has expanded its thermal management portfolio with the introduction of two innovative thermal interface materials (TIMs). The company announced the launch of Laird™ Tflex™ CR910, a two-part dispensable liquid gap filler, and Laird™ Tgrease™ 3000, a high-performance thermal grease engineered to address the growing thermal challenges in artificial intelligence (AI), automotive electronics, industrial systems, and other high-power applications.
As electronic devices continue to become more powerful and compact, effective thermal management has emerged as one of the most critical aspects of modern system design. AI workloads, high-performance computing (HPC), electric vehicles (EVs), advanced networking equipment, and next-generation power electronics are generating unprecedented heat levels, placing increased demands on thermal interface materials that can efficiently transfer heat while maintaining long-term reliability.
Rising Heat Challenges in Next-Generation Electronics
The Qnity rapid adoption of AI technologies and the growing use of high-power semiconductor devices have significantly increased power densities within electronic systems. Designers are now expected to deliver smaller, faster, and more efficient products while ensuring they remain reliable under demanding operating conditions.
Modern electronic architectures feature increasingly complex assemblies with tighter mechanical tolerances, making thermal design more challenging than ever before. Components must withstand repeated thermal cycling, mechanical stress, and elevated operating temperatures without compromising performance.
As a result, thermal management has evolved from being a supporting design consideration into a fundamental engineering requirement. Selecting the right thermal interface material is now essential for improving system efficiency, extending product lifespan, and maintaining consistent performance across mission-critical applications.
Qnity Addresses Evolving Customer Needs
Recognizing these industry trends, Qnity has developed two new thermal management solutions that help engineers overcome today’s thermal challenges while preparing for future technology demands.
According to Chuck Xu, President of Interconnect Solutions at Qnity, managing heat has become one of the semiconductor industry’s most significant engineering priorities.
He explained that the continued advancement of AI, advanced computing platforms, and electrification technologies is driving system performance to unprecedented levels, making efficient thermal management essential. Rather than simply protecting electronic components from overheating, thermal solutions now play a central role in enabling next-generation innovation.
Xu added that the latest product introductions reflect Qnity’s ongoing commitment to providing advanced materials and engineering expertise that support innovation throughout the semiconductor and electronics ecosystem.
Laird™ Tflex™ CR910: High-Performance Liquid Gap Filler
One of the company’s latest innovations is Laird™ Tflex™ CR910, a two-part dispensable liquid gap filler specifically designed for applications requiring efficient heat transfer across uneven or large interface gaps.
The material offers a high thermal conductivity of 9.2 W/mK, enabling efficient heat dissipation between heat-generating components and cooling solutions. Its low thermal resistance helps improve thermal performance, while its soft and compliant characteristics allow it to conform easily to complex surfaces and manufacturing tolerances.
Unlike conventional thermal pads, the dispensable liquid formulation simplifies application in automated manufacturing environments and provides excellent coverage for intricate component layouts.
Tflex™ CR910 is particularly well suited for electronic systems where maintaining consistent thermal contact is critical despite mechanical movement, vibration, or uneven surface profiles. By accommodating varying gap sizes while maintaining excellent thermal conductivity, the material helps engineers improve both system reliability and manufacturing flexibility.
The product is expected to find applications across AI accelerators, high-performance computing systems, telecommunications infrastructure, automotive electronics, industrial automation equipment, and other advanced electronic platforms requiring efficient heat management.
Tgrease™ 3000 Designed for High-Temperature Power Devices
Complementing the new gap filler is Laird™ Tgrease™ 3000, a next-generation, non-silicone thermal grease developed specifically for high-temperature semiconductor applications.
As wide-bandgap semiconductor technologies such as Silicon Carbide (SiC) and Gallium Nitride (GaN) become increasingly common in electric vehicles, renewable energy systems, industrial power conversion, and AI infrastructure, operating temperatures continue to rise beyond the capabilities of many conventional thermal interface materials.
Tgrease™ 3000 has been engineered to operate reliably at temperatures of up to 200°C, making it suitable for demanding environments where thermal stability is essential.
The material delivers 3.2 W/mK thermal conductivity while maintaining low thermal resistance across extremely thin bond lines. Its formulation also minimizes pump-out—a common issue in thermal greases where repeated heating and cooling cycles gradually force material away from the interface.
By significantly reducing pump-out, the grease maintains consistent thermal performance over extended operating periods, helping lower device temperatures, improve long-term reliability, and extend overall product life.
These characteristics make Tgrease™ 3000 particularly attractive for designers working with high-power SiC and GaN devices used in electric drivetrains, charging infrastructure, industrial motor controls, data centers, and advanced AI computing systems.
Supporting Future Technology Roadmaps
Qnity emphasized that the development of these new thermal interface materials is backed by its extensive expertise in materials science and application engineering.
The company works closely with customers throughout the product development cycle to understand evolving thermal requirements and create customized solutions that address both current and future design challenges.
Rather than focusing solely on today’s applications, Qnity aims to support long-term technology roadmaps by developing materials capable of meeting the increasing thermal demands of future semiconductor devices and electronic systems.
This collaborative engineering approach enables manufacturers to optimize thermal performance while improving manufacturability, reducing reliability risks, and accelerating product development.
Thermal Management Becomes a Strategic Enabler
Industry analysts increasingly recognize thermal management as a key enabler of innovation rather than simply a method of preventing overheating.
As AI models become larger, processors become more power-intensive, and electric vehicles adopt higher-voltage architectures, thermal interface materials are playing a critical role in maximizing efficiency and sustaining system performance.
Advanced thermal materials help reduce junction temperatures, improve energy efficiency, minimize thermal resistance, and enable designers to pack greater computing power into increasingly compact form factors.
Solutions such as Tflex™ CR910 and Tgrease™ 3000 demonstrate how material innovation can directly support advances in semiconductor manufacturing, advanced computing, automotive electrification, telecommunications infrastructure, and industrial electronics.
Strengthening the Thermal Management Portfolio
With the addition of these two products, Qnity continues to strengthen its comprehensive portfolio of thermal management solutions designed for next-generation electronic systems.
By combining high-performance materials with deep application expertise, the company aims to help customers overcome increasingly complex thermal challenges while improving reliability, manufacturing efficiency, and overall system performance.
As AI, electrification, and high-performance computing continue to reshape the electronics industry, advanced thermal interface materials will remain essential for enabling faster, more efficient, and more reliable electronic systems. Through innovations such as Laird™ Tflex™ CR910 and Tgrease™ 3000, Qnity is positioning itself to support the evolving needs of semiconductor manufacturers and electronics designers worldwide.
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