Samsung Electro-Mechanics announced its participation in the KPCA Show 2025 (International Advanced Semiconductor Substrate and Packaging Industry Exhibition), held at Songdo Convensia, Incheon, from September 3–5. At Korea’s largest PCB and semiconductor packaging exhibition, the company will present its next-generation semiconductor package substrate technologies for AI, servers, and automotive applications, along with its innovative glass core substrates.
The semiconductor package substrate (FCBGA) serves as the bridge between high-density chips and mainboards, enabling efficient signal and power transmission. As AI, cloud, server, and automotive industries demand ever-greater performance, substrates have become a critical enabler of semiconductor advancements. This has accelerated the need for ultra-complex solutions with higher layer counts, finer circuit patterns, tighter interlayer alignment, and thinner form factors.
Booth Highlights
Samsung Electro-Mechanics organized its booth into two main zones:
- Advanced Package Substrate Zone
Showcasing high-end AI and server FCBGA substrates currently in mass production, including newly developed ultra-large, ultra-complex substrates — over 10 times larger in area and with three times more internal layers than standard FCBGAs. Samsung Electro-Mechanics remains the only company in Korea mass-producing server FCBGAs, recognized globally for its leadership in this domain.
The zone also introduced 2.1D package substrate technology for direct chip-to-chip connections without a silicon interposer and Co-Package substrates that integrate SoC and memory into a single board. - AI & Automotive Package Substrate Zone
Featuring FCCSP substrates for AI smartphone APs (ranked No. 1 in global market share), high-reliability automotive FCBGA substrates, ultra-thin UTC substrates for AI laptops, and embedded substrates with built-in passive components.
A key highlight was the unveiling of glass core package substrates, widely regarded as the next-generation standard. These substrates achieve 40% thinner profiles compared to conventional types, while delivering superior warpage control and enhanced signal performance for large-area applications.
Leadership and Vision
Eungsoo Kim, EVP and Chief of the Package Solution Business Unit at Samsung Electro-Mechanics, commented:
“Samsung Electro-Mechanics continues to secure differentiated technologies in the high-end semiconductor package substrate market for AI, autonomous driving, and servers. We will strengthen partnerships with global clients and drive future growth by leveraging our high-performance substrate technologies.”
Samsung Electro-Mechanics has a proven record of innovation, becoming the first company in Korea to mass-produce AI and server FCBGA substrates in 2022. Moving forward, the company aims to advance ultra-large-area, ultra-high-layer, and ultra-fine circuit implementation, while accelerating the adoption of glass-based materials. These efforts will reinforce its leadership in high-end semiconductor package substrates for servers, networks, and next-generation mobility.
