Second International Compact Modeling Conference (ICMC 2026) Brings Global Semiconductor Experts Together in Long Beach, California
The second edition of the International Compact Modeling Conference (ICMC 2026) promises to be a landmark event for the global semiconductor community. Sponsored collaboratively by the Si2 Compact Model Coalition, IEEE, and IEEE Electron Devices Society (EDS), this highly anticipated two-day conference will provide a premier forum for experts across academia, industry, and research organizations to discuss, share, and advance the state-of-the-art in semiconductor device modeling.
ICMC 2026 will take place on July 30-31, 2026, at the historic Queen Mary in Long Beach, California. Nestled on the scenic waterfront, the venue offers both a picturesque setting and world-class facilities for technical presentations, networking sessions, and collaborative discussions, making it an ideal location for the exchange of ideas among engineers, researchers, and industry professionals.
The conference aims to bring together thought leaders from across the semiconductor ecosystem, including design engineers, process technologists, model developers, and application specialists. The focus is on bridging gaps between device physics, compact modeling, and practical applications in circuit design. By creating an environment that encourages knowledge sharing and collaboration, ICMC 2026 will foster innovation in semiconductor modeling and enable attendees to stay at the forefront of technological advances that are shaping the future of electronics.
Corporate and Media Support
ICMC 2026 has garnered support from several leading global technology organizations, reflecting the importance of compact modeling in the semiconductor industry. Corporate sponsors include some of the most influential names in the field:
- Cadence – A global leader in electronic design automation (EDA) software and engineering services, known for enabling designers to bring innovative electronics to market efficiently.
- Keysight Technologies – A provider of electronic measurement solutions, including software and instrumentation critical for accurate device characterization and model validation.
- Micron Technology – A leading manufacturer of memory and storage solutions, whose research in device physics and process technology contributes directly to modeling advancements.
- Qualcomm – An industry pioneer in mobile and wireless technologies, relying on accurate compact models for optimizing integrated circuits in smartphones, IoT devices, and networking solutions.
- Sandia National Laboratories – A U.S. government laboratory specializing in advanced research, including semiconductor device reliability and modeling for high-performance applications.
- Siemens – An international powerhouse in electronics and industrial automation, supporting semiconductor innovation through advanced modeling and simulation platforms.
- Synopsys – A leading provider of EDA software, IP, and services, helping design engineers create complex integrated circuits and systems.
- TSMC (Taiwan Semiconductor Manufacturing Company) – The world’s largest semiconductor foundry, whose modeling needs are critical for cutting-edge process technologies and next-generation devices.
Media sponsors supporting the event include SemiWilki and Semiconductor Digest, two prominent industry publications that provide insight and coverage on emerging trends in device modeling, semiconductor design, and EDA technologies. Their involvement ensures that the research and insights presented at ICMC 2026 will reach a broad global audience, amplifying the impact of the conference.
Call for Contributions and Research Themes
ICMC 2026 invites researchers, engineers, and practitioners to contribute original research papers, case studies, and presentations that advance the understanding and application of compact models. The conference emphasizes both theoretical developments and practical implementations, fostering collaboration between researchers and industry professionals.
For this edition, the conference highlights several key themes, reflecting current challenges and opportunities in semiconductor device modeling:
- Electrostatic Discharge (ESD) Modeling for Protection Design – ESD events can cause severe damage to semiconductor devices, leading to functional failures or degraded performance. Accurate modeling of ESD behavior is essential for designing robust protection circuits. Contributions in this area may focus on device-level modeling of ESD phenomena, circuit-level simulation techniques for ESD resilience, or new methodologies for predicting ESD behavior under extreme conditions.
- Reliability and Aging-Aware Compact Models and Simulation Techniques – As devices shrink and operating conditions become more demanding, reliability and aging effects such as bias temperature instability, hot-carrier degradation, and electromigration become increasingly significant. Papers addressing reliability-aware compact models, degradation prediction, and lifetime estimation methodologies are encouraged. These contributions are vital for enabling designers to create long-lasting, dependable devices and systems.
- AI and Machine Learning for Model Development – Artificial intelligence and machine learning are emerging as powerful tools in semiconductor modeling. Contributions in this area may include techniques for automated parameter extraction, model calibration, improved simulation efficiency, and predictive modeling of device behavior. This theme highlights the transformative potential of AI in accelerating model development and improving the accuracy and efficiency of circuit simulations.
In addition to these highlighted themes, ICMC 2026 also welcomes submissions across broad research areas related to semiconductor device modeling:
- Application of Device Models – Practical applications of compact models in circuit design, system-level simulation, and technology evaluation. This includes examples of integrating device models into EDA tools or demonstrating their impact on performance, power, and reliability analysis.
- Device Model Development – Innovations in compact model formulation, including physics-based models, empirical models, and hybrid approaches that balance accuracy with computational efficiency.
- Model Enhancements and Implementations – Research aimed at improving existing models, implementing new features, or enhancing model usability and compatibility with simulation environments.
- Emerging Devices – Modeling efforts for next-generation devices such as FinFETs, Gate-All-Around (GAA) FETs, nanosheet transistors, and other novel semiconductor architectures. Contributions may explore unique physical effects, scaling challenges, and simulation strategies for these devices.
The conference provides multiple avenues for contribution, including oral presentations, where authors can engage directly with attendees, and poster presentations, which allow for more interactive discussions and deeper technical engagement with interested participants.
Submission and Important Dates
The paper submission deadline for ICMC 2026 has been extended to March 2, 2026, giving researchers additional time to prepare and submit high-quality contributions. Submitted papers will undergo a rigorous peer-review process, ensuring that the conference features cutting-edge research and technically sound work. Accepted papers will be presented during the conference and may also be published in associated IEEE conference proceedings, offering authors broad visibility and recognition in the semiconductor community.
Researchers and practitioners interested in contributing to ICMC 2026 are encouraged to visit the conference website at https://2026.si2-icmc.org for detailed submission guidelines, registration information, and conference updates.
Networking and Collaboration Opportunities
Beyond the technical sessions, ICMC 2026 will offer numerous opportunities for networking, collaboration, and professional development. Attendees can engage with leading industry experts, explore new modeling tools and techniques, and participate in discussions on emerging trends and challenges in semiconductor device modeling. Corporate sponsors and exhibitors will also showcase their latest technologies, providing hands-on demonstrations and facilitating knowledge exchange between developers, designers, and researchers.
Engage with ICMC 2026 on Social Media
To facilitate ongoing engagement and community building, ICMC maintains an active presence on social media platforms such as LinkedIn, where participants can connect with speakers, sponsors, and fellow researchers. Following the conference online ensures that attendees stay informed about announcements, session highlights, and networking opportunities before, during, and after the event.
About the Organizers
Silicon Integration Initiative (Si2) – The Si2 Compact Model Coalition operates under the umbrella of the Silicon Integration Initiative Inc., a global, not-for-profit membership organization dedicated to advancing semiconductor design and modeling. With approximately 70 corporate members, Si2 fosters collaboration on trusted standards and shared solutions that help reduce development costs and increase design productivity for semiconductor foundries, fabless design companies, and EDA software providers. More information about Si2 can be found at https://si2.org/.
Institute of Electrical and Electronics Engineers (IEEE) – IEEE is the world’s largest technical professional organization devoted to advancing technology for the benefit of humanity. Through its global network of members, conferences, publications, and educational programs, IEEE supports professionals working across all areas of electrical engineering, electronics, and computing. More information about IEEE can be found at https://www.ieee.org/.
IEEE Electron Devices Society (EDS) – IEEE EDS promotes the professional growth of its members and the wider electronics community by facilitating access to technical information, publications, educational resources, and recognition programs. The society enhances the public visibility of electronic devices research, focusing on advancing knowledge in device physics, modeling, and technology development.
