TDK to Showcase Next-Generation AI, Automotive, and Power Solutions at electronica Shanghai 2026
TDK Corporation has announced that it will present its latest technologies and innovations at electronica Shanghai 2026, which will take place from in Shanghai, China. Under its new corporate brand identity and the tagline “In Everything, Better,” the company will demonstrate a broad portfolio of advanced products, components, and system-level solutions designed to support the rapidly expanding artificial intelligence ecosystem.
At the exhibition, TDK will highlight innovations spanning multiple industries, including automotive electronics, information and communication technology (ICT), industrial automation, energy infrastructure, and next-generation computing. Through its integrated approach, the company aims to showcase how its expertise in materials science, sensing technologies, passive components, magnetic solutions, power electronics, software, and AI can help customers create more intelligent, efficient, reliable, and sustainable electronic systems.
By bringing together technologies that address challenges from edge AI to high-performance computing, smart mobility, and industrial digitalization, TDK seeks to demonstrate how its innovations contribute to building a future where advanced electronics improve everyday experiences and industrial productivity alike.
Enabling Physical AI and Intelligent Human-Machine Interaction
Artificial intelligence is evolving rapidly beyond cloud-based computing environments and increasingly becoming embedded in edge devices and physical systems. As AI capabilities move closer to users and real-world applications, demand is growing for technologies that can seamlessly connect digital intelligence with physical environments.
At electronica Shanghai 2026, TDK will showcase a comprehensive range of solutions designed for Physical AI applications. These include technologies for smart glasses, extended reality (XR), augmented reality (AR), virtual reality (VR), intelligent sensing systems, and advanced human-machine interfaces.
One of the key highlights will be TDK’s smart glasses technologies. These solutions enable the development of wearable devices capable of continuously sensing and interpreting their surroundings. By capturing visual and environmental data, smart glasses can support generative AI applications that provide contextual insights, real-time information, and enhanced user assistance.
Such technologies have the potential to transform numerous sectors, including industrial operations, healthcare, education, logistics, and consumer electronics. By integrating AI capabilities directly into wearable devices, users can access information more naturally and efficiently without relying exclusively on traditional interfaces.
TDK will also showcase innovations aimed at creating more immersive and intuitive user experiences through haptic technologies. Human-machine interaction is increasingly becoming a critical component in emerging applications such as mixed reality, gaming, remote collaboration, and digital assistance.
Visitors to the exhibition will experience several advanced haptic demonstrations, including touch-sensitive zoom controls, immersive haptic glove systems, and motion-aware interaction platforms. These technologies are designed to provide users with tactile feedback that closely resembles real-world sensations, making digital interactions more engaging and intuitive.
By combining haptic feedback systems with high-performance motion sensing technologies, TDK aims to support the development of next-generation XR, AR, and VR devices capable of delivering highly realistic experiences.
Motion sensing solutions based on inertial measurement units (IMUs) will also be highlighted. These technologies provide accurate tracking capabilities and contribute to improving responsiveness, precision, and user comfort in wearable devices and immersive systems.
Advanced Sensor Technologies for Embodied Robotics
Robotics represents another major area of focus for TDK at electronica Shanghai 2026. As humanoid robots and autonomous systems become increasingly sophisticated, there is growing demand for highly accurate and dependable sensing technologies capable of supporting complex movements and interactions.
TDK will exhibit a variety of advanced sensor solutions specifically developed for embodied robotics applications.
Among these technologies are ultra-small tunneling magnetoresistance (TMR) sensors, which offer exceptional sensitivity while maintaining compact form factors. These sensors can play a critical role in applications requiring precise position detection, movement monitoring, and magnetic field sensing.
The company will also present advanced MEMS-based inertial measurement units that function as the “inner ear” of robotic systems. These sensors help robots maintain balance, orientation, and movement stability, supporting more natural and adaptive behaviors.
As humanoid robots become increasingly capable of operating in human environments, precise motion sensing will be essential for ensuring safety, reliability, and smooth interaction.
Temperature monitoring is another critical aspect of robotic performance. TDK will demonstrate its NTC temperature sensors, which provide highly accurate thermal measurements and contribute to maintaining optimal operating conditions across robotic systems.
By delivering precise environmental data, these sensors help improve performance, increase system reliability, and support long-term operational efficiency.
Industrial AI for Smarter Manufacturing
In addition to robotics, TDK will highlight its Industrial AI technologies aimed at improving manufacturing productivity and equipment reliability.
Industrial facilities are increasingly embracing digital transformation strategies that combine advanced sensing technologies, edge computing, and artificial intelligence to optimize operations.
TDK’s condition monitoring and predictive maintenance solutions are designed to address these requirements.
The company will showcase an intelligent monitoring platform that integrates industrial expertise with lightweight machine learning algorithms optimized for edge deployment. This approach enables ultra-low-latency AI processing directly at the edge, eliminating the need for constant cloud connectivity.
The system continuously captures data related to vibration patterns, temperature variations, and operational parameters across industrial assets.
By analyzing micro-vibrations and subtle thermal anomalies, the solution can identify emerging issues that may be difficult or impossible for human operators to detect.
This capability enables manufacturers to anticipate equipment failures before they occur, reducing unplanned downtime and improving maintenance planning.
Operating as a continuously active digital intelligence platform, the system functions as a 24-hour operational brain capable of monitoring industrial environments in real time.
Early detection of anomalies allows organizations to enhance productivity, maximize equipment availability, and increase overall factory efficiency.
These capabilities align with broader Industry 4.0 initiatives, where predictive analytics and AI-driven automation are becoming increasingly important in modern manufacturing environments.
Compact Ultrasonic Sensing Solutions
TDK will also introduce compact ultrasonic sensor modules designed for deployment in demanding operating environments.
These integrated modules combine a transducer, signal processor, and driver electronics within an extremely compact package.
The company has engineered these solutions with mechanically isolated decoupling structures and enhanced electromagnetic compatibility characteristics.
This design approach contributes to improved reliability while enabling operation under challenging environmental conditions.
Because of their small size and robust performance characteristics, ultrasonic sensing modules can support a broad range of applications, including industrial automation, robotics, smart infrastructure, and intelligent consumer products.
Their versatility makes them particularly attractive for designers seeking compact sensing technologies without compromising functionality or performance.
Powering the Future of AI Data Centers
As artificial intelligence workloads continue to expand, data centers are facing unprecedented increases in computational requirements and energy consumption.
Meeting these demands requires innovations across the entire power infrastructure ecosystem.
At electronica Shanghai 2026, TDK will present a comprehensive strategy described as “From Grid to Core.”
This approach addresses power delivery challenges throughout the AI data center architecture, from utility-level infrastructure to processor-level power management.
The showcased solutions encompass several critical applications, including power supply units for AI servers, battery energy storage systems, uninterruptible power supplies, solid-state transformers, and point-of-load power delivery technologies positioned near processors.
Among the featured products will be ultra-compact aluminum electrolytic snap-in capacitors designed to deliver high performance within limited installation spaces.
TDK will also present MKP DC-link film capacitors, which support efficient energy conversion processes in high-power applications.
Surface-mount NTC thermistors engineered for thermal management and temperature monitoring applications will further demonstrate the company’s capabilities in addressing the reliability requirements of modern computing infrastructure.
A major exhibit will include a partner-developed 12-kilowatt AI server power supply reference design.
This high-power-density system leverages TDK’s advanced components to enable efficient operation at elevated frequencies while supporting the growing energy requirements of next-generation AI platforms.
As AI computing continues to evolve, efficient power management solutions are expected to play a crucial role in reducing energy consumption and improving the sustainability of digital infrastructure.
Supporting the Evolution of Smart Mobility
Automotive technologies represent another significant theme within TDK’s exhibition portfolio.
The automotive industry is undergoing rapid transformation driven by electrification, automation, connectivity, and intelligent cockpit experiences.
To support these trends, TDK will showcase technologies spanning electric propulsion systems, energy storage, charging infrastructure, thermal management, safety systems, and in-vehicle electronics.
Among the featured products are customized CeraLink capacitors optimized for demanding automotive applications.
The company will also display CarXield electromagnetic compatibility filters designed to enhance system reliability and minimize electromagnetic interference.
Additional technologies include magnetic components for battery management systems and InsuGate transformers that support efficient energy transfer within electric vehicle architectures.
Sensor technologies remain fundamental to modern vehicles, and TDK will present a broad portfolio of sensing solutions.
These include temperature sensors, pressure sensors, current sensors, Hall sensors, and TMR magnetic sensors developed to support environmental monitoring and vehicle stability systems.
Visitors will also be able to explore demonstrations featuring stray-field-resistant Hall and TMR position sensors.
These technologies are intended for applications such as braking systems and thermal management, where precise measurements are essential for ensuring safety and efficiency.
Next-generation MEMS inertial measurement units designed for headlight leveling and vehicle dynamics control will further illustrate TDK’s commitment to intelligent mobility solutions.
Collectively, these technologies contribute to improving vehicle performance, enhancing passenger experiences, and supporting the transition toward smarter and more sustainable transportation systems.
Industrial and Energy Solutions for High-Power Applications
TDK will also place significant emphasis on industrial and energy applications.
The global transition toward renewable energy, electrified transportation, and smart infrastructure is creating increased demand for highly efficient power systems.
At electronica Shanghai 2026, the company will present solutions designed specifically for electric vehicle fast-charging systems and industrial power applications.
Featured technologies include high-performance film capacitors, input protection devices, high-voltage contactors, AC-DC power supplies, AC-AC conversion systems, and DC-DC power modules.
These solutions are engineered to enhance energy efficiency, improve reliability, and support the deployment of high-power infrastructure.
As electrification accelerates worldwide, robust power electronics technologies are becoming increasingly important for enabling resilient and efficient energy ecosystems.
TDK’s portfolio aims to address these evolving requirements by providing advanced components capable of supporting demanding operating conditions.
Smarter ICT and Consumer Devices
In the ICT and consumer electronics sectors, manufacturers continue to seek smaller, lighter, and more energy-efficient solutions.
TDK will showcase innovations developed for smartphones, Internet of Things devices, true wireless stereo earbuds, gaming accessories, wearable technologies, and assistive applications.
Among the featured technologies are high-precision TMR sensors for gaming peripherals.
These sensors can deliver enhanced accuracy and responsiveness, contributing to improved gaming experiences.
The company will also present ultra-low-power MEMS microphones designed for applications such as keyboard interfaces, acoustic sensing systems, and intelligent devices.
By integrating time-of-flight sensing technologies, motion sensors, and MEMS microphones, TDK aims to provide application solutions that enhance usability and support smarter interaction capabilities.
These technologies are expected to contribute to more intuitive and context-aware devices capable of adapting to user behavior and environmental conditions.
Addressing EMC Challenges in Complex Electronic Systems
As electronic systems become more integrated and operate at higher frequencies and voltages, electromagnetic compatibility has become an increasingly important consideration.
Ensuring reliable operation while minimizing interference is essential for applications ranging from electric vehicles and industrial equipment to AI infrastructure and communication systems.
TDK will present a comprehensive portfolio of electromagnetic compatibility solutions at the exhibition.
The company will also introduce engineering support services and testing capabilities available through its Shanghai C-PAC EMC Laboratory.
These services help customers evaluate system performance, identify potential electromagnetic issues, and implement effective mitigation strategies.
Through EMC testing and remediation recommendations, TDK seeks to assist manufacturers in accelerating product development while ensuring compliance with increasingly stringent industry standards.
Demonstrating “In Everything, Better”
At electronica Shanghai 2026, TDK intends to showcase how its diverse technologies come together to enable smarter, more efficient, and more sustainable electronic systems.
By combining expertise in materials science, sensing technologies, power electronics, software, artificial intelligence, and system integration, the company aims to support customers across a broad spectrum of industries.
Visitors attending electronica Shanghai 2026 will have the opportunity to explore TDK’s latest innovations firsthand at Booth N1-205.
Through its comprehensive portfolio and integrated technology demonstrations, TDK seeks to bring its brand vision, “In Everything, Better,” to life—illustrating how advanced electronics can help shape a more intelligent, connected, and sustainable future.
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