Teradyne to highlight advanced semiconductor test innovations and automation solutions at the IESA Vision Summit, showcasing next-generation technologies for the evolving chip industry.
Teradyne, Inc. a global leader in automated test equipment (ATE) and advanced robotics, is set to showcase its latest semiconductor test innovations at the 2026 IESA Vision Summit, taking place on February 25–26 at the Leela Bhartiya City Convention Centre in Bengaluru. As one of the most influential semiconductor events in India, the IESA Vision Summit brings together policymakers, industry leaders, technology innovators, and global semiconductor stakeholders to shape the future of India’s rapidly expanding chip ecosystem.
Returning to the summit with renewed momentum, Teradyne aims to reinforce its long-standing commitment to supporting semiconductor manufacturers across the globe — and particularly in India — with cutting-edge test platforms designed to address increasing device complexity, advanced packaging trends, AI-driven workloads, and the evolving requirements of high-volume manufacturing.
Strengthening Engagement with India’s Semiconductor Ecosystem
India’s semiconductor ambitions have accelerated significantly in recent years, supported by strong government initiatives, infrastructure investments, and a growing base of design and manufacturing talent. The IESA Vision Summit serves as a critical platform for collaboration, dialogue, and technological exchange within this ecosystem. Teradyne’s participation underscores its strategic interest in partnering with Indian semiconductor companies, foundries, OSATs, and fabless innovators who are driving next-generation chip development.
At booth #13 and #14, Teradyne will present four flagship semiconductor test solutions engineered to meet the challenges of modern electronics manufacturing. These systems are designed not only to improve throughput and yield but also to ensure precision, scalability, and cost efficiency across a wide spectrum of device categories — from microcontrollers and automotive electronics to high-performance SoCs and AI accelerators.
Showcasing Advanced Semiconductor Test Platforms
As semiconductor devices become increasingly complex — integrating more functions into smaller nodes while demanding greater reliability — advanced test solutions play a crucial role in ensuring performance and quality. Teradyne’s portfolio addresses these needs with platforms that combine high parallelism, flexibility, speed, and efficiency.
Teradyne UltraFLEX: High Parallelism and Unmatched Flexibility
The Teradyne UltraFLEX platform stands as one of the industry’s most versatile and widely adopted automated test systems. Designed for high parallelism, UltraFLEX enables manufacturers to test multiple devices simultaneously, significantly increasing throughput without compromising precision.
Its modular architecture allows customization to suit diverse device requirements, making it ideal for logic, mixed-signal, RF, and system-on-chip (SoC) testing. As semiconductor manufacturers face mounting pressure to reduce time to market while maintaining stringent quality standards, UltraFLEX delivers the performance and scalability needed to keep pace with innovation cycles.
High-performance computing devices, networking components, and advanced consumer electronics all benefit from the platform’s adaptability. With growing demand in AI and data processing applications, UltraFLEX provides the reliability and throughput necessary to support next-generation silicon.
Teradyne UltraFLEXplus: Speed and Scalability for Advanced SoCs
Building on the success of UltraFLEX, Teradyne UltraFLEXplus introduces enhanced speed, expanded scalability, and greater efficiency. This platform is particularly well-suited for complex SoC and mixed-signal devices that power AI systems, data centers, advanced automotive technologies, and 5G infrastructure.
As chip designs incorporate heterogeneous integration and advanced packaging techniques, testing requirements become more demanding. UltraFLEXplus addresses these complexities by offering higher pin counts, improved signal integrity, and faster test execution — all critical factors in high-performance and high-reliability markets.
For manufacturers serving AI and data center customers, where performance and power efficiency are paramount, UltraFLEXplus ensures accurate validation of intricate architectures. Its ability to scale with device evolution makes it a future-ready solution aligned with the trajectory of semiconductor innovation.
Teradyne J750: Proven Versatility and Cost Efficiency
The Teradyne J750 remains a trusted solution for testing microcontrollers, sensors, analog components, and automotive devices. Recognized for its versatility and dependable performance, J750 provides a cost-efficient platform for a broad range of mainstream semiconductor applications.
Automotive electronics, in particular, demand rigorous reliability and compliance with strict safety standards. The J750 platform supports comprehensive testing workflows that help manufacturers meet these requirements while maintaining competitive cost structures.
In an era where connected vehicles, industrial IoT systems, and smart devices are proliferating, the J750 continues to offer a balanced combination of performance, flexibility, and affordability — making it a cornerstone of many semiconductor production lines worldwide.
Teradyne ETS Platform: Optimized for High-Volume Manufacturing
Designed specifically for high-volume manufacturing environments, the Teradyne ETS Platform delivers high-throughput and cost-effective test solutions for discrete, power discrete, analog, and mixed-signal devices.
Power semiconductors, in particular, are gaining importance due to electrification trends in automotive, renewable energy systems, and industrial automation. Testing these components at scale requires robust, reliable systems capable of maintaining accuracy under demanding production conditions.
The ETS Platform addresses these needs by optimizing efficiency and minimizing downtime, enabling manufacturers to maintain consistent output while controlling operational costs. Its streamlined design supports scalability and adaptability for evolving product portfolios.
Empowering Innovation Across the Semiconductor Value Chain
Together, these four platforms demonstrate Teradyne’s comprehensive approach to semiconductor test. From high-performance computing and AI accelerators to automotive microcontrollers and power devices, the company’s solutions span the full spectrum of semiconductor applications.
As the electronics industry navigates rapid digital transformation, advanced test solutions become essential to sustaining innovation. Accurate and efficient testing ensures that devices perform reliably in real-world environments — whether powering data centers, enabling autonomous driving features, or supporting industrial automation systems.
Teradyne’s technologies help semiconductor manufacturers:
- Accelerate innovation cycles
- Enhance product quality and reliability
- Reduce time to market
- Improve manufacturing efficiency
- Lower total cost of ownership
By combining engineering excellence with deep industry expertise, Teradyne continues to strengthen its role as a trusted partner for semiconductor companies worldwide.
Thought Leadership and Industry Dialogue
Beyond showcasing technology, Teradyne will actively contribute to the IESA Vision Summit’s thought leadership program. On February 26 at 9:30 AM, the company will deliver a keynote address focused on the future of semiconductor test and its role in enabling India’s manufacturing ambitions.
Additionally, Teradyne will participate in a panel discussion titled “Developing the Semiconductor Manufacturing Playbook for India” at 11:15 AM on the same day. The panel will explore strategies for building resilient supply chains, fostering domestic manufacturing capabilities, and aligning with global semiconductor trends.
Shannon Poulin, President of the Semiconductor Test Group at Teradyne, expressed enthusiasm about the company’s return to the summit:
“Teradyne is excited to return to the IESA Vision Summit, connecting with the leaders and innovators driving India’s dynamic semiconductor ecosystem. Our advanced test platforms are empowering customers to tackle the most complex challenges in semiconductor development and manufacturing. We look forward to engaging with industry partners and sharing our latest advancements at this important event.”
A Broader Vision: Test and Robotics
While semiconductor test remains central to Teradyne’s operations, the company also maintains a strong presence in advanced robotics. Its robotics portfolio includes collaborative robots and mobile robots that enhance manufacturing and warehouse operations across industries.
By combining automated test expertise with robotics innovation, Teradyne supports the broader automation transformation occurring across global supply chains. This integrated vision positions the company at the intersection of semiconductor technology and smart manufacturing.
Commitment to the Future of Semiconductor Innovation
As India strengthens its semiconductor roadmap and global demand for advanced electronics continues to rise, Teradyne’s presence at the 2026 IESA Vision Summit reflects both opportunity and commitment. By delivering scalable, efficient, and future-ready test platforms, the company plays a vital role in enabling the next generation of chips that will power AI systems, connected infrastructure, electric vehicles, and intelligent devices.
Attendees are invited to visit booth #13 and #14 to explore Teradyne’s solutions firsthand and engage with experts who are shaping the future of semiconductor testing.
With decades of innovation, a broad technology portfolio, and a strong global footprint, Teradyne continues to define excellence in automated test equipment and advanced robotics. As semiconductor complexity increases and market demands evolve, the company remains focused on helping customers achieve higher performance, better quality, and faster time to market — ensuring that tomorrow’s electronic breakthroughs are built on a foundation of precision and reliability.
