Rambus Advances AI Infrastructure with New LPDDR6 SOCAMM2 Power Management Chip
Rambus Inc, a leading provider of semiconductor chips and silicon intellectual property (IP), has announced a new Power Management Integrated Circuit (PMIC) designed to support LPDDR6 Small Outline Compression Attached Memory Modules (SOCAMM2). The new chip aims to deliver efficient power management and high performance for next-generation artificial intelligence (AI) infrastructure.
Developed in collaboration with customers and ecosystem partners, the PMIC represents an important addition to Rambus’ server memory product portfolio. It is designed to address the growing demand for energy-efficient memory solutions as AI workloads continue to expand across data centers and advanced computing platforms.
Supporting Energy-Efficient AI Infrastructure
The rapid growth of AI training, inference and agentic AI applications is increasing the demand for memory systems that deliver higher bandwidth and performance while consuming less power. For AI infrastructure providers, improving tokens per watt has become a key consideration, as it measures how efficiently computing systems process AI workloads.
To meet these requirements, the industry is increasingly adopting specialized memory technologies that balance power efficiency, performance, scalability and compact design. Low-power double data rate (LPDDR) memory is gaining attention as a solution for next-generation AI servers because of its energy-efficient operation.
SOCAMM2 technology brings the advantages of LPDDR memory to a compact, modular and serviceable server-memory design. This architecture is intended to support the demanding requirements of modern AI systems while providing flexibility for memory integration and maintenance.
LPDDR6 SOCAMM2, which is currently under development, represents the next stage in the evolution of LPDDR-based server memory. Rambus’ new PMIC is designed to help enable this emerging architecture by providing the power-management capabilities needed for high-performance, energy-efficient operation.
Industry Collaboration Drives Memory Innovation
Rambus executives highlighted the importance of advanced memory technologies in meeting the changing needs of AI infrastructure.
Rami Sethi, senior vice president and general manager of Memory Interface Chips at Rambus, noted that inference and agentic AI are creating new opportunities for memory innovation across data centers. He explained that the new PMIC builds on Rambus’ expertise in server-memory power management and reflects collaboration with industry leaders and the broader AI ecosystem.
The solution is intended to support memory architectures that improve energy efficiency while maintaining the performance needed for increasingly demanding AI workloads.
Micron Technology also emphasized the growing importance of low-power memory solutions. Praveen Vaidyanathan, vice president and general manager of Cloud Memory Products at Micron, said that LPDRAM is becoming increasingly important as AI systems require greater memory capacity, bandwidth and power efficiency.
Micron has played a role in advancing low-power memory technologies for data centers and continues to collaborate with ecosystem partners on industry standards such as SOCAMM2. Rambus’ investment in LPDDR6 power-management solutions supports the development of a broader low-power memory ecosystem for future AI platforms.
Building on Rambus’ Server Memory Expertise
Rambus offers a broad portfolio of memory interface chipsets for DDR- and LPDDR-based memory modules. Its products include registering clock drivers (RCDs), power management integrated circuits, voltage regulators, serial presence detect (SPD) hubs and temperature sensors.
These components help manage memory communication, power delivery, configuration and monitoring in advanced server systems.
The company continues to develop memory chipset solutions for high-volume CPU-based servers while expanding its portfolio to address the requirements of accelerated AI computing. This strategy positions Rambus to support evolving memory architectures as data centers demand higher performance and improved energy efficiency.
Rambus already offers a complete LPDDR5X SOCAMM2 chipset that provides essential power delivery, configuration and telemetry functions for current-generation SOCAMM2 modules.
Building on this foundation, the new PMIC and Rambus SPD Hub extend the company’s LPDDR-based memory roadmap to support the upcoming LPDDR6 SOCAMM2 architecture. This approach is intended to provide customers with the necessary chipset technologies as memory standards evolve.
Advanced Power Management for Next-Generation Systems
Designed for the dynamic workloads of future AI systems, the LPDDR6 SOCAMM2 PMIC and SPD Hub are intended to provide precise and efficient module-level power management.
Their capabilities include advanced power conversion, power sequencing, telemetry and fault protection. These functions help regulate power delivery, monitor operating conditions and support reliable memory-module operation.
The PMIC converts the system’s incoming supply voltage into the voltage levels required by LPDDR6 DRAM and other active components on the memory module. Efficient voltage conversion and accurate power regulation are important for reducing unnecessary power consumption while maintaining stable performance.
Power sequencing helps ensure that components receive power in the appropriate order, while telemetry provides information about operating conditions. Fault protection adds another layer of support for system reliability.
Together, these capabilities are designed to help next-generation accelerated computing platforms meet their requirements for performance, reliability and power efficiency.
As AI models and applications continue to grow in complexity, improvements in memory power management can help data center operators optimize energy use and overall system efficiency.
Product Availability
Rambus has begun sampling its PMIC designed for LPDDR6 SOCAMM2 to lead customers. The sampling phase enables selected customers to evaluate the technology as development of next-generation memory solutions progresses.
About Rambus
Rambus Inc. provides semiconductor chips and silicon IP for data centers and AI infrastructure. With more than three decades of semiconductor experience, the company develops technologies that address bottlenecks between memory and processing in data-intensive computing systems.
Its solutions are designed to enable greater memory bandwidth, power efficiency and security across next-generation computing platforms. Through its products and technologies, Rambus aims to make data faster and safer.
Forward-Looking Statements
The announcement contains forward-looking statements regarding Rambus’ products, expected development timelines, operational performance and future business outlook. These statements are based on management’s current expectations and assumptions and are subject to risks and uncertainties.
Actual results may differ materially because of factors including market conditions, product development outcomes and risks described in the company’s annual and quarterly reports filed with the U.S. Securities and Exchange Commission. Rambus does not guarantee that anticipated developments will occur as expected and undertakes no obligation to update forward-looking statements except as required by applicable law.
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