Baya Systems Partners with AdoreSys to Expand Semiconductor IP Access Across China and APAC
Baya Systems, an innovator in software-driven fabric and system IP solutions, and AdoreSys, a leading semiconductor design solutions provider, have announced a strategic partnership aimed at expanding access to advanced semiconductor IP and design capabilities across China and the Asia-Pacific (APAC) region.
The collaboration brings together Baya Systems’ WeaveIP™ fabric and WeaverPro™ software platform with AdoreSys’ expertise in ASIC design, chiplet integration, IP distribution, and silicon implementation. By combining these capabilities, the companies aim to provide semiconductor and systems companies with a more integrated approach to developing complex system-on-chip (SoC) and multi-die architectures.
The partnership comes at a time when demand for advanced semiconductor technologies is accelerating across AI, high-performance computing (HPC), data centers, automotive, and other data-intensive applications. As system architectures become increasingly complex, efficient movement of data between processing elements, memory, accelerators, chiplets, and other components has become a critical factor in achieving performance, power efficiency, scalability, and time-to-market goals.
Through the partnership, AdoreSys will provide customers across its regional markets with access to Baya Systems’ technology, supported by its own semiconductor design and implementation expertise. This combination is designed to create a more streamlined path from early system architecture and design exploration through physical implementation and silicon realization.
“As Baya continues to scale globally, AdoreSys provides the local relationships and deep design expertise that can help us expand our reach in China and strengthen our presence across APAC,” said Sailesh Kumar, CEO of Baya Systems. “There’s a clear need for more flexible, data-movement-focused technologies. Together with AdoreSys, we can help bring those capabilities to more customers across the region.”
Addressing the Growing Complexity of Data Movement
Modern semiconductor designs are increasingly defined by the amount and complexity of data they need to process and move. AI workloads, cloud computing, autonomous and advanced automotive systems, and HPC platforms require architectures capable of handling large volumes of data while maintaining high performance and controlling power consumption.
As chip designs evolve toward heterogeneous and multi-die architectures, efficient interconnect and fabric technologies are becoming increasingly important. Designers need the ability to explore different architectural approaches early in the development process, evaluate performance and power trade-offs, and optimize data movement before committing to implementation.
Baya Systems’ software-driven approach is designed to address these challenges by combining architectural exploration capabilities with scalable fabric IP. Its WeaverPro™ software platform enables early exploration and optimization of system architectures, while the WeaveIP™ portfolio provides high-performance, scalable fabric IP intended for implementation in advanced semiconductor systems.
By making these capabilities available alongside AdoreSys’ ASIC design and implementation services, customers can gain access to technologies and expertise across multiple stages of the semiconductor development lifecycle.
Supporting Customers from Architecture to Silicon
The partnership is intended to help semiconductor companies reduce the complexity associated with developing advanced SoCs and multi-die systems. Instead of treating architecture development, interconnect selection, IP integration, and implementation as separate activities, the combined offering provides a more connected path across these stages.
Early architectural exploration can help design teams identify potential bottlenecks and evaluate different data-movement strategies before physical implementation begins. Once an architecture is established, Baya’s WeaveIP™ fabric technology can support implementation, while AdoreSys brings its experience in ASIC design, integration, and silicon realization.
This integrated approach can help customers optimize key design objectives, including performance, power efficiency, scalability, and development time. It also provides semiconductor companies with greater flexibility as they address increasingly sophisticated system requirements.
“As one of the world’s fastest-moving semiconductor markets, succeeding in Asia requires innovating quickly,” said KengSu Teoh, CEO of AdoreSys. “Our focus markets in HPC, data center and automotive increasingly demand a new generation of data-movement technology. Baya’s software-driven approach is strongly aligned with our vision, helping customers explore and optimize advanced architectures faster and move more efficiently from concept to silicon.”
Expanding Semiconductor Capabilities Across China and APAC
China and the broader Asia-Pacific region continue to play an important role in the global semiconductor ecosystem. The region includes major semiconductor design, manufacturing, systems, automotive, cloud computing, and technology markets, creating significant opportunities for companies developing next-generation silicon solutions.
For semiconductor companies operating in these markets, access to advanced IP and specialized design expertise can be an important factor in accelerating product development. Through its regional relationships and semiconductor engineering capabilities, AdoreSys is positioned to help extend Baya Systems’ technology to a broader customer base.
The partnership also reflects a growing need for specialized solutions that can address the architectural challenges associated with AI and other data-intensive workloads. As system designers increasingly adopt heterogeneous computing, chiplet-based architectures, and advanced multi-die designs, interconnect and data-movement technologies are becoming central to overall system performance.
By combining Baya’s fabric technology and software-based architectural tools with AdoreSys’ regional market presence and implementation capabilities, the companies seek to help customers navigate these challenges more efficiently.
Enabling Next-Generation SoC and Multi-Die Designs
The collaboration is particularly relevant for applications where high-bandwidth and efficient data movement are critical. AI and HPC systems, for example, require large numbers of processing resources to communicate efficiently. Data-center platforms must balance performance and power requirements at scale, while automotive systems increasingly depend on sophisticated computing architectures capable of supporting demanding workloads.
Baya Systems’ protocol-agnostic approach is designed to provide flexibility across different system architectures, while its chiplet-ready technology addresses the evolving requirements of heterogeneous and multi-die systems.
Together, Baya Systems and AdoreSys aim to provide customers with a broader set of capabilities for exploring, designing, integrating, and implementing advanced semiconductor architectures. The partnership is expected to support companies seeking to accelerate development while addressing the performance, power, and complexity challenges associated with next-generation silicon.
About Baya Systems
Baya Systems is a Series B semiconductor IP company pioneering software-defined, chiplet-ready fabric technology for AI, HPC, automotive, and edge applications. Its WeaveIP™ fabric and WeaverPro™ software platform deliver a unified, protocol-agnostic interconnect solution designed for the requirements of next-generation AI and high-performance systems.
Headquartered in Santa Clara, California, Baya Systems is backed by leading technology investors and has been recognized by Frost & Sullivan for Technology Innovation Leadership in Semiconductor IP Interconnect Solutions.
Learn more at bayasystems.com.
About AdoreSys
AdoreSys is a specialized semiconductor solutions provider offering advanced ASIC design services, chiplet integration, and IP distribution. Headquartered in Singapore, the company serves enterprise customers across cloud computing, automotive, and AI markets worldwide.
Through its combination of semiconductor engineering expertise and regional market relationships, AdoreSys helps customers develop and implement advanced silicon solutions.
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